Pikhta Tech LLC · https://firai.ru · Datasheet v0.9 dated 3 Oct 2026

PH-J01 — Jetson board

PH-J01 — ПХ-J01 in Russian documents

Board without enclosure: NVIDIA Jetson Orin Nano 8GB (Super) module on a carrier board with 2×GbE / 4×USB 3.2 / M.2, heatsink with fan, 128 GB NVMe with system image — for embedding in your enclosure.

Availabilitybuild to order, 2–5 weeks
Lead time2–5 weeks (module — made to order)
Minimum order (MOQ)1 unit; batch — from 10 units
Priceon request, RUB excl. VAT
PH-J01
diagram; photo — after the first samples

Outline drawing; product photos are on the product page. Dimensions: ≈100×80×25 mm (board with module and fan heatsink).

  • Orin Nano 8GB, Super mode: 67 TOPS sparse (≈33 dense); options Orin Nano 4GB, Orin NX 8GB / 16GB
  • Carrier board ≈100×80 mm: 1×2.5GbE + 1×GbE, 4×USB 3.2 (3×Gen2), USB-C recovery, DP 1.4, CSI ×2, 40-pin, 2×M.2 M + M.2 E, RTC
  • Heatsink with PWM fan, 128 GB NVMe with system image; DC 9–19 V, 5.5×2.5 jack
  • No enclosure or PSU: embed in your device; aluminum enclosure and adapter — options

Typical uses: embedding in your own device · robot and AGV · test bench and development.

1. Purpose

NVIDIA Jetson Orin Nano 8GB module (Super mode) on a compact carrier board in the form factor of NVIDIA's official carrier (≈100×80 mm): 1×2.5GbE + 1×GbE, 4×USB 3.2, USB-C, DisplayPort, CSI ×2, 40-pin, 2×M.2 M + M.2 E; heatsink with PWM fan and 128 GB NVMe with our system image on JetPack 6.2. No enclosure or power supply — for embedding in your device, cabinet or robot: enclosure, DC/DC and mounting are from the options or yours. Module options: Orin Nano 4GB, Orin NX 8GB / 16GB.

Straight talk: A board without enclosure is for teams building their own device: temperature and reliability depend on your enclosure and airflow, so we provide a drawing and a thermal test method rather than a "−40…+70" promise. Need a ready-to-run Jetson device — PH-J31; no CUDA needed — PH-K01.

2. Platform

SoC / acceleratorNVIDIA Jetson Orin Nano 8GB — 6×Cortex-A78AE, Ampere GPU 1024 CUDA / 32 Tensor Cores; options: Orin Nano 4GB, Orin NX 8GB / 16GB
TOPS INT8 dense≈33 TOPS INT8 dense (NVIDIA publishes 67 sparse, Super mode); Orin NX 16GB — ≈78 dense / 157 sparsemethod: NVIDIA datasheet: sparse INT8 in MAXN SUPER mode (JetPack 6.2); dense = sparse / 2; Jetson Orin Nano is the baseline on our bench
Memory8 GB LPDDR5 128-bit, 102 GB/s in Super mode (68 GB/s in the original mode); Orin NX 16GB — 16 GB, 102 GB/s
Storage128 GB NVMe (M.2 2280) with system image; second M.2 M — for your own drive

3. Interfaces

USB4×USB 3.2 Type-A (3×Gen 2 10 Gbps + 1×USB 2.0), 1×USB-C (recovery / device mode), 2×USB 2.0 on a header
Ethernet / PoE1×2.5GbE + 1×GbE RJ-45
RS-485 / CAN / RS-232debug UART; UART / I2C / SPI on the 40-pin header; RS-232 / RS-485 / CAN — adapter or USB, made to order
GPIO / relay40-pin (NVIDIA pinout), 12-pin header for buttons / auto power-on, 4-pin PWM fan, RTC battery
M.22×M.2 2280 M-key (NVMe; one is the system drive), 1×M.2 2230 E-key (Wi-Fi/BT — option)
Video outputDisplayPort 1.4
Wi-Fi / BT / LTEnonebase unit without radio — no FSB notification and no security questions on site; for mobile use we fit a module imported with notification

4. Power and thermal

Power input9–19 V DC, 5.5×2.5 mm jack; power supply not included (12 V 5 A adapter — option; 9–36 V DC/DC — option)
Power consumption (typical)≈8 W (module 15 W mode)
Power consumption (peak)≤25 W (MAXN SUPER); Orin NX 16GB — up to 40 W
Coolingheatsink with PWM fan on the module; final power mode — depends on airflow in your enclosure
Enclosure temperature in a closed cabinet at +40 °C ambientmeasured after the first sample is tested; we publish the measurement, not a datasheet value

5. Mechanical

Dimensions≈100×80×25 mm (board with module and fan heatsink)
Weight≈200 g
Mounting4 mounting holes for M3 standoffs (carrier-board drawing in the product passport); DIN-rail bracket and enclosure — options
Connectorsstandard RJ-45 / USB / DP, DC 5.5×2.5, 40-pin

6. Environment and protection

Operating temperature0…+50 °C without enclosure (carrier-board reference); in your enclosure — per thermal test, method — /en/testing/
Ingress protectionnone — open board
Vibration / shocknot rated; module secured with screws, board on standoffs

7. Bench measurements

Measurements are expected with the first samples. What we measure: FPS INT8 YOLOv8n; FPS INT8 YOLOv8s; FPS INT8 YOLO11n; FPS INT8 YOLO11s; FPS INT8 ResNet50; FPS INT8 OCR (PP-OCRv4 rec); 1080p streams; accuracy after quantization.

test-bench baseline: the same row as PH-J31; measured with the first samples on the test bench; method — /en/testing/

8. Configuration options

OptionPrice
Orin Nano 4GBon request
Orin Nano 8GB (Super) — basebase
Orin NX 8GBon request
Orin NX 16GBon request
Aluminum enclosure with fanon request
12 V 5 A power adapteron request

Prices for 1 / 10 / 100 units and for options — in the quotation within 2 business days, valid 30 days. The contract includes a price revision formula tied to the Bank of Russia exchange rate and the DRAM index.

9. What's included

10. Compatibility

CamerasPH-Cam-M (MIPI CSI) ×2; PH-Cam-K (USB, global shutter); PH-Cam-S / PH-Cam-O (PoE) — via an injector or switch
Power / PSU12 V 5 A adapter (option); 12/24 V onboard power via 9–36 V DC/DC (option)
RuntimesJetPack 6.2 (L4T 36.4): CUDA 12.6, TensorRT 10, cuDNN, DeepStream 7; ONNX Runtime (CUDA / TensorRT EP); Docker / containerd (nvidia-container-runtime); ROS 2 (Humble) in a container

11. Updates and support

Image updates and system-component fixes — free during the warranty (1 year), delivered from your network; afterwards — under a support contract.

12. Documents and origin

EAC declarationin progress — declaration issued to Pikhta Tech LLC, in progress
FSB notificationnot required — no radio modules
Datasheetthis document: PDF v0.9 and the web version on this website
Product passportin progress — single template, PDF with each delivery
Vendor security questionnaireon request — under NDA
Origin and our partNVIDIA Jetson Orin module (country of manufacture per the batch marking: Taiwan / China); carrier board — contract manufacturer (ODM, China); system image, incoming inspection and kitting — in Russia; EAC declaration is issued to Pikhta Tech LLC.

13. Chip and sensor vendor documentation

We do not host third-party documents — links to official pages only; full chip datasheets are available from the vendor or its distributor.

Pikhta Tech LLC · https://firai.ru · info@firai.ru · +7 (916) 877-93-11. Datasheet v0.9 dated 3 Oct 2026; specifications without bench measurements are component datasheet values, indicative until the sample is tested. Current version and quotation: https://firai.ru/en/catalog/jetson/ph-j01/.